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pcb assembly

Conflict Minerals Reporting With IPC-1755

Printed circuit board fabrication and assembly relies on various metals for conduction, soldering, anti-corrosion, and other material properties that ensure high performance and reliability. The nature of these in-demand metals (not just exclusive to electronics manufacturing) makes them ripe for exploitation in some areas of the world. Many businesses have focused on internal and inter-organizational…

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PCB Delamination Causes and Prevention Techniques

While designers place components and route circuits on multiple layers, manufacturers have to fuse the disparate layers of the board into a single, continuous product. High heat and pressure cause board laminate material to flow throughout the crevices of the design and encapsulate the board shape; this process is reversible (sometimes destructively so) under certain…

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PCB Beveling for Edge Connectors

PCB Trace Width and Spacing: Optimizing HDI Layouts

Printed circuit board designers must communicate the manufacturing intentions of a project so that there aren’t any problems in building the board. To do that, consider all ways to ensure that data in PCB design documentation is as straightforward as possible. In the layout, designers must balance the circuit’s optimal needs against the board’s constraints…

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IPC-1752A and Material Declaration Management

Managing supplier materials for electronics manufacturing can be challenging. Poor, incomplete, or absent material declarations can become significant roadblocks when sourcing compliant sub-products and components. Research and correspondence with suppliers can be slow-moving at times, and time is of the essence for designers on tight production schedules. The industry standard IPC-1752A helps to coordinate efforts between the disparate chemical, material, and sub-product manufacturers integral to PCBA production.

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