The amount of technology in a smartphone is truly astounding when you consider all its capabilities. Communication, computing, networking, navigating, photography, and various sensors are just a few examples, and amazingly, they all fit in the palm of your hand. Electronic miniaturization for devices like cell phones isn’t possible without the benefits provided by high-density interconnect (HDI) printed circuit boards. And the need for smaller circuit boards with increased circuitry will only grow as new technologies continue to be introduced.
To successfully build high-density printed circuit boards, you need someone who understands both the manufacturing requirements and the design. At VSE, we regularly partner with electronic innovators who need HDI PCBs to support the amount of circuitry required in their advanced technology. And as our customers have found out, not only does HDI allow for more circuitry to fit into a smaller space, but it offers better signal performance. This page will summarize what you need to know about high-density interconnect PCB design to prepare for HDI design requirements.