Considering all its capabilities, the amount of technology in a smartphone is truly astounding. Communication, computing, networking, navigating, photography, and various sensors are just a few examples; amazingly, they all fit in the palm of your hand. Electronic miniaturization for devices like cell phones isn’t possible without the benefits of high-density interconnect (HDI) printed circuit boards. Designers need an HDI PCB manufacturer to spec and build high-density printed circuit boards successfully.
Features for HDI Designs
|Microvias require a more intricate lamination/drilling cycle. However, designers can shrink via hole diameters significantly and free up routing with stacked/staggered layer transitions.
|Flex / rigid-flex
|Flex and rigid-flex boards allow for greater space utilization within compact enclosures, replacing more intricate wire harnesses.
|The highest component pinout possible. It requires microvias and minimal trace widths for breakout.
|High % SMD
|While SMD is already a higher propensity for PCBAs, HDI box builds are likely to have an even greater restriction on component height.