HDI PCB Manufacturer

Shrinking Board Sizes for Big Applications

Modern electronics, especially portable devices, can have an astounding amount of circuit functionality. Communication, networking, navigating, photography, and various sensors are just some of the features of a handheld device. Electronic miniaturization for these devices isn’t possible without the benefits of high-density interconnect (HDI) printed circuit boards. Designers need an HDI PCB manufacturer to successfully specify and build HDI-printed circuit boards.

Features for HDI Designs
Microvia Shrunk via hole diameters significantly frees up routing with stacked/staggered layer transitions.
Flex / rigid-flex Flex and rigid-flex boards allow greater space utilization within compact enclosures, replacing more intricate wire harnesses.
BGAs The highest component pinout possible requires microvias and minimal trace widths for breakout.
High % SMD While SMD has a higher propensity for PCBAs, HDI box builds are likely to have an even greater restriction on component height.

Exploring High-Density Interconnect PCBs

A high-density circuit board provides many benefits to product designers, including circuit area reductions. Smaller circuitry generally improves performance by increasing functionality while reducing per-area power consumption. Here are some other benefits that product designers will realize by using HDI technology:

 

Key HDI PCB Design Benefits:

  • Lower overall PCBA costs
  • Increased circuitry density
  • Better PCBA reliability
  • Increased signal integrity and performance
  • Decreased susceptibility to electromagnetic interference (EMI)
  • Better thermal management
  • Overall, improved efficiency in the design
One of the chief advantages of HDI technology in printed circuit board design is adding more functionality to the board through compression of the circuitry. There are several methods to accomplish this design compression:

  • Newer components with smaller dimensions
  • Smaller pin pitches, which reduce the space necessary for routing
  • Tighter component packing
  • Multiple via types in the design, including via-in-pad and microvia structures
  • Use of smaller trace widths and spaces
  • Thinner substrates support additional routing layers

HDI PCB Manufacturer - DFM Requirements And Benefits

Stackups

High-density interconnect circuit boards require a carefully conceived board layer stackup configuration before the layout begins. This process will ensure the design’s impedance-controlled routing calculations are correct while optimizing signal integrity.

 

Design Rules

CAD systems can typically allow or disallow specific via types on certain nets or change spacing rules and trace width values. Design rules are essential in HDI design to avoid EMI and other potential signal integrity problems.

 

Routing

HDI designs use smaller trace widths and spacings that enhance the board’s routing density. Additional routing channels on inner layers also open up with vias that do not go entirely through the board. This configuration allows parts with high pin counts and low pin pitches to be routed on an HDI board. These blind and buried microvias can support or replace traditional through-hole drilling while offering significantly smaller drill diameters.

 

Connect With Your Contract Manufacturer for HDI Designs

An HDI PCB manufacturer will employ different production methods from standard PCBs, such as laser imaging for thinner trace widths. Thinner substrates and microvias require different laser drilling and sequential build-up fabrication processes. At VSE, we understand all the processes involved with high-density interconnect design and manufacturing. We are committed to providing the exemplary service necessary for these designs. We aim to ensure you get the expected quality in your next HDI circuit board project.

If you are looking for a CM that prides itself on its care and attention to detail to ensure that each PCB assembly is built to the highest standards, look no further than VSE. Contact us today to learn more about partnering with us for your next project.

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