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The characteristic impedance of transmission lines starts with the board stackup.

IPC-2221A: Generic Standards for PCB Manufacturability

Despite the industry’s best efforts, a large gulf between PCB designers and manufacturers can exist. Often, most designers come from an academic background that provides broad electrical engineering knowledge that they must apply to the specific case of PCB design. On the other hand, manufacturers start from the specificity of equipment, processes, and regulations to…

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PCB layout constraints

Microstrip vs. Stripline: Transmission Line Comparison

As signal speeds increase on printed circuit boards, their potential for emitting or being victimized by noise and interference intensifies. Layout steps are necessary to clear the signal’s pathways, including arranging the board stackup in microstrip or stripline configurations to achieve the best signal integrity. This setup protects sensitive high-speed signals from much noise and…

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Time Domain Reflectometry: PCB Defect Detection

During PCB layout, designers typically have to indicate the impedance of traces to ensure a proper balance of low-loss characteristics and power-handling capabilities. Before layout, the designer determines the trace width in some field solver software based on the desired impedance and other stackup factors like the surrounding substrates‘ dielectric constant(s) and the distance between…

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The characteristic impedance of transmission lines starts with the board stackup.

Solder Mask Expansion Ensures Solder Joint Reliability

Even small-lot PCB manufacturing relies on automated solder deposition processes to expedite the assembly process while providing greater consistency in solder application/joint reliability. Solder masking is necessary to prevent unintentional bridging of exposed copper and enhance the reliability of copper features that do not require atmospheric exposure. Using a carefully cut stencil, manufacturers apply an…

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The characteristic impedance of transmission lines starts with the board stackup.

Fine-Pitch PCB Assemblies for HDI Design

High-density pinout components using a package-on-package (PoP) construction, most notably ball grid arrays (BGAs), feature pitch (pin-to-pin distances) much smaller than historical standards. Given their proliferation in modern electronics due to their broad functionality, designers and manufacturers have had to adapt processes to accommodate the tighter pitches. Fine-pitch PCB design focuses on how layout and…

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