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Parasitic capacitance between high dv/dt devices (think transformers, transistors) and ground is a significant cause of common-mode EMI.

Few feelings are worse than performing a part buy and realizing the components aren’t suitable for the design as planned. Whether incorrect package styles or electrical parameters, the result is a delay in manufacturing while waiting for the next shipment. An even more ghastly possibility is the inclusion of components designated for obsolescence, which can…

PCB core vs. prepreg materials have differences (primarily, copper foil) but also many similarities due to the common prepreg.

Copper-clad laminate is the industry term for the PCB core material that combines copper foil with a prepreg dielectric material.

The medical device industry forecast for 2024 is strong domestically and globally and should exhibit continual future growth for the near term.

Designers can choose between different copper thickness values, but most boards utilize a standard value of 1 oz. for most applications.