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Electronics manufacturers must understand the difference between HASL vs. ENIG when specifying their PCB fabrication to meet their requirements.

High-density pinout components using a package-on-package (PoP) construction, most notably ball grid arrays (BGAs), feature pitch (pin-to-pin distances) much smaller than historical standards. Given their proliferation in modern electronics due to their broad functionality, designers and manufacturers have had to adapt processes to accommodate the tighter pitches. Fine-pitch PCB design focuses on how layout and…

AI is the new paradigm shift within businesses, offering an exciting level of automation and creation tools that are revolutionizing industries. As exciting as this development is, there’s been less concern about the changes in the data center infrastructure necessary to support these complex system architectures. AI server racks have additional considerations and concerns that…

PCB manufacturing is divisible into two primary stages: fabrication and assembly. The surface finish process inextricably links them together, ensuring sufficient bonding between the bare board and the components for continuous performance and extended reliability. PCB surface finishes come in many flavors, but HASL is the most prominent for non-consumer devices: as an extension of…

PCB drill hole tolerance bakes in some of the inherent variance of the fabrication process to ensure drilling matches design intent.

PCB drill hole tolerance bakes in some of the inherent variance of the fabrication process to ensure drilling matches design intent.